300554.SHE – NanJing Sanchao Advanced Materials Co Ltd

Last Day

Tools & Accessories

• Trailing PE:
• Forward PE:
• Price Sales TTM:
• Price Book MRQ:
• Enterprise Value:
• Enterprise Value Revenue:
• Enterprise Value Ebitda:
• Beta:

• Shares Outstanding:
• Market Capitalization:
• Market Capitalization Mln:
• EBITDA:
• PE Ratio:
• PEG Ratio:
• Wall Street Target Price:
• Book Value:
• Dividend Share:
• Dividend Yield:
• Earnings Share:
• EPS Estimate Current Year:
• EPS Estimate Next Year:
• EPS Estimate Next Quarter:
• EPS Estimate Current Quarter:
• Most Recent Quarter:
• Profit Margin:
• Operating Margin TTM:
• Return On Assets TTM:
• Return On Equity TTM:
• Revenue TTM:
• Revenue Per Share TTM:
• Quarterly Revenue Growth YOY:
• Gross Profit TTM:
• Diluted Eps TTM:
• Quarterly Earnings Growth YOY:

• Type:
• Name:
• Exchange:
• Currency Code:
• Currency Name:
• Currency Symbol:
• Country Name:
• Fiscal Year End:
• IPO Date:
• International Domestic:
• Sector:
• Industry:
• Address:
• Country:
• Listings:
• Web URL:
• Full Time Employees:
• Updated At:
• Gic Sector:
• Gic Group:
• Gic Industry:
• Gic SubIndustry:

NanJing Sanchao Advanced Materials Co.,Ltd. researches, develops, and manufactures diamond and CBN tools for automobile, semiconductor, photovoltaic solar, and cemented carbide industries. It offers electroplated diamond wires, diamond wires for sapphire and silicon slicing, and silicon bricking/squaring/cropping; precision tools, including dicing blades, edge wheel for sapphire wafers, notched wheel for silicon and sapphire wafers, back grinding for diamond wheels for silicon wafers, hubless blades, and CMP-disk; and semiconductor manufacturing equipment. The company provides grinding wheels; grooving of diamond and CBN wheel; segmented difference wheel; diamond and CBN wheels; double griding disk; peripheral grinding wheels; centerless griding wheels; griding wheels for crankshaft, inner hole machining, and bearing; and verified bond wheels, as well as diamond and CBN griding wheels. In addition, it offers cutting fluids for sapphire wafers, silicon, and polysilicon cutting applications and grinding of optical lens, prism lens, and plane mirror. The company was founded in 1999 and is headquartered in Nanjing, China. Address: No. 77, Zecheng Roa, Nanjing, China, 211124

The data, information and layout displayed above cannot be used for commercial purpose. We do not accept any liability for reliance of the information above. We can provide description of source data regarding our industry research and valuation research to our clients upon request.